XC3S1400AN-4FGG676C by AMD(Advanced Micro Devices) – Specifications

AMD(Advanced Micro Devices) XC3S1400AN-4FGG676C is a XC3S1400AN-4FGG676C from AMD(Advanced Micro Devices), part of the Programmable Logic Device (CPLDs/FPGAs). It is designed for 25344 2816 1400000 FBGA-676(27x27) Programmable Logic Device (CPLDs/FPGAs) ROHS. This product comes in a FBGA-676(27x27) package and is sold as Tray. Key features include:

  • Embedded Block RAM: 589824bit
  • Operating Temperature Range: 0℃~+85℃
  • Logic Elements / Cells: 25344
  • Logic Array Blocks: 2816
  • Number of Logic Gates: 1400000

Additional details: This product is environmentally friendly, does not contain a battery, and weighs approximately 1 grams.

More on XC3S1400AN-4FGG676C

Full Specifications of XC3S1400AN-4FGG676C

Model NumberXC3S1400AN-4FGG676C
Model NameAMD(Advanced Micro Devices) XC3S1400AN-4FGG676C
CategoryProgrammable Logic Device (CPLDs/FPGAs)
BrandAMD(Advanced Micro Devices)
Description25344 2816 1400000 FBGA-676(27x27) Programmable Logic Device (CPLDs/FPGAs) ROHS
RoHSLead free / RoHS Compliant
UnitPiece
Weight:1.000 grams / 0.035274 oz
Package / CaseFBGA-676(27x27)
Package / ArrangeTray
BatteryNo
ECCN3A001A7A
Embedded Block RAM589824bit
Operating Temperature Range0℃~+85℃
Logic Elements / Cells25,344
Logic Array Blocks2,816
Number of Logic Gates1,400,000

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