HCZZ0530-4 by Hong Cheng – Specifications

Hong Cheng HCZZ0530-4 is a HCZZ0530-4 from Hong Cheng, part of the Wire To Board Connector. It is designed for 1x4P 4P 1 0.8mm Tin 4 -25℃~+85℃ 500mA Phosphor coppe Brick nogging SMD,p=0.8mm Wire To Board Connector ROHS. This product comes in a SMD,p=0.8mm package and is sold as Tape & Reel (TR). Key features include:

• Pins Structure: 1x4P
• Number of Pins: 4P
• Number of Rows: 1
• Pitch: 0.8mm
• Contact Plating: Tin
• Number of PINs Per Row: 4
• Operating Temperature Range: -25℃~+85℃
• Current Rating (Max): 500mA
• Contact Material: Phosphor coppe
• Mounting Style: Brick nogging

Additional details: This product is environmentally friendly, does not contain a battery, and weighs approximately 0.296 grams.