XDFP-0915-0108 by Lian Xin Technology – Specifications

Lian Xin Technology XDFP-0915-0108 is a XDFP-0915-0108 from Lian Xin Technology, part of the SD Card / Memory Card Connector. It is designed for -45℃~+80℃ 1.8mm Gold MicroSD card (TF card) 260℃ Copper Self bomb SMD SD Card / Memory Card Connector ROHS. This product comes in a SMD package and is sold as Tape & Reel (TR). Key features include:

  • Operating Temperature Range: -45℃~+80℃
  • Maximum Body Height: 1.8mm
  • Contact Plating: Gold
  • Card Type: MicroSD card (TF card)
  • Soldering Temperature(Max): 260℃
  • Contact Material: Copper
  • Card Connection Mode: Self bomb

Additional details: This product is environmentally friendly, does not contain a battery, and weighs approximately 0.796 grams.

More on XDFP-0915-0108

Full Specifications of XDFP-0915-0108

Model NumberXDFP-0915-0108
Model NameLian Xin Technology XDFP-0915-0108
CategorySD Card / Memory Card Connector
BrandLian Xin Technology
Description-45℃~+80℃ 1.8mm Gold MicroSD card (TF card) 260℃ Copper Self bomb SMD SD Card / Memory Card Connector ROHS
RoHSLead free / RoHS Compliant
UnitPiece
Weight:0.796 grams / 0.028078 oz
Package / CaseSMD
Package / ArrangeTape & Reel (TR)
BatteryNo
ECCN-
Operating Temperature Range-45℃~+80℃
Maximum Body Height1.8mm
Contact PlatingGold
Connector Type-
Card TypeMicroSD card (TF card)
Soldering Temperature(Max)260℃
Contact MaterialCopper
Card Connection ModeSelf bomb

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