MPC755BVT300LE by NXP Semicon – Specifications

NXP Semicon MPC755BVT300LE is a MPC755BVT300LE from NXP Semicon, part of the Microcontroller Units (MCUs/MPUs/SOCs). It is designed for 300MHz FCPBGA-360(25x25) Microcontroller Units (MCUs/MPUs/SOCs) ROHS. This product comes in a FCPBGA-360(25x25) package and is sold as Bag-packed. Key features include:

  • Operating Temperature Range: 0℃~+105℃
  • CPU Maximum Speed: 300MHz

Additional details: This product is environmentally friendly, does not contain a battery, and weighs approximately 1 grams.

Full Specifications of MPC755BVT300LE

Model NumberMPC755BVT300LE
Model NameNXP Semicon MPC755BVT300LE
CategoryMicrocontroller Units (MCUs/MPUs/SOCs)
BrandNXP Semicon
Description300MHz FCPBGA-360(25x25) Microcontroller Units (MCUs/MPUs/SOCs) ROHS
RoHSLead free / RoHS Compliant
UnitPiece
Weight:1.000 grams / 0.035274 oz
Package / CaseFCPBGA-360(25x25)
Package / ArrangeBag-packed
BatteryNo
ECCN3A991A2
Operating Temperature Range0℃~+105℃
CPU Core-
CPU Maximum Speed300MHz

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