2132250810 by MOLEX – Specifications

MOLEX 2132250810 is a 2132250810 from MOLEX, part of the Wire To Board Connector. It is designed for 1x8P 8P 1 Tin 1.5mm 8 -40℃~+105℃ Copper Alloy Brick nogging SMD,P=1.5mm Wire To Board Connector ROHS. This product comes in a SMD,P=1.5mm package and is sold as Bag-packed. Key features include:

• Pins Structure: 1x8P
• Number of Pins: 8P
• Number of Rows: 1
• Contact Plating: Tin
• Pitch: 1.5mm
• Number of PINs Per Row: 8
• Operating Temperature Range: -40℃~+105℃
• Contact Material: Copper Alloy
• Mounting Style: Brick nogging

Additional details: This product is environmentally friendly, does not contain a battery, and weighs approximately 0.152 grams.