2132250930 by MOLEX – Specifications

MOLEX 2132250930 is a 2132250930 from MOLEX, part of the Wire To Board Connector. It is designed for 1x9P 9P 1 Tin 1.5mm 9 -40℃~+105℃ Copper Alloy Brick nogging SMD,P=1.5mm Wire To Board Connector ROHS. This product comes in a SMD,P=1.5mm package and is sold as Bag-packed. Key features include:

  • Pins Structure: 1x9P
  • Number of Pins: 9P
  • Number of Rows: 1
  • Contact Plating: Tin
  • Pitch: 1.5mm
  • Number of PINs Per Row: 9
  • Operating Temperature Range: -40℃~+105℃
  • Contact Material: Copper Alloy
  • Mounting Style: Brick nogging

Additional details: This product is environmentally friendly, does not contain a battery, and weighs approximately 0.152 grams.

More on 2132250930

Full Specifications of 2132250930

Model Number2,132,250,930
Model NameMOLEX 2132250930
CategoryWire To Board Connector
BrandMOLEX
Description1x9P 9P 1 Tin 1.5mm 9 -40℃~+105℃ Copper Alloy Brick nogging SMD,P=1.5mm Wire To Board Connector ROHS
RoHSLead free / RoHS Compliant
UnitPiece
Weight:0.152 grams / 0.005362 oz
Package / CaseSMD,P=1.5mm
Package / ArrangeBag-packed
BatteryNo
ECCNEAR99
Pins Structure1x9P
Number of Pins9P
Number of Rows1
Contact PlatingTin
Pitch1.5mm
Number of PINs Per Row9
Operating Temperature Range-40℃~+105℃
Current Rating (Max)-
Contact MaterialCopper Alloy
Mounting StyleBrick nogging

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