5031543090 by MOLEX – Specifications

MOLEX 5031543090 is a 5031543090 from MOLEX, part of the Wire To Board Connector. It is designed for 2x30P 60P 2 Tin 1.5mm 30 -40℃~+105℃ Copper Alloy Brick nogging SMD,P=1.5mm Wire To Board Connector ROHS. This product comes in a SMD,P=1.5mm package and is sold as Tape & Reel (TR). Key features include:

  • Pins Structure: 2x30P
  • Number of Pins: 60P
  • Number of Rows: 2
  • Contact Plating: Tin
  • Pitch: 1.5mm
  • Number of PINs Per Row: 30
  • Operating Temperature Range: -40℃~+105℃
  • Contact Material: Copper Alloy
  • Mounting Style: Brick nogging

Additional details: This product is environmentally friendly, does not contain a battery, and weighs approximately 0.152 grams.

More on 5031543090

Full Specifications of 5031543090

Model Number5,031,543,090
Model NameMOLEX 5031543090
CategoryWire To Board Connector
BrandMOLEX
Description2x30P 60P 2 Tin 1.5mm 30 -40℃~+105℃ Copper Alloy Brick nogging SMD,P=1.5mm Wire To Board Connector ROHS
RoHSLead free / RoHS Compliant
UnitPiece
Weight:0.152 grams / 0.005362 oz
Package / CaseSMD,P=1.5mm
Package / ArrangeTape & Reel (TR)
BatteryNo
ECCNEAR99
Pins Structure2x30P
Number of Pins60P
Number of Rows2
Contact PlatingTin
Pitch1.5mm
Number of PINs Per Row30
Operating Temperature Range-40℃~+105℃
Current Rating (Max)-
Contact MaterialCopper Alloy
Mounting StyleBrick nogging

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